The Splash is a laboratory spray etching machine with integrated rinse. The machine is suitable for single and double-sided copper-clad base material. This equipment is designed with a special focus on ergonomic, clean and low carryover etching and rinsing. Areas of application: • acid or aqueous-alkaline etching of circuit boards, metal panels etc • Developing of positive or negative-working photo resists or laminates (aqueous-alkaline process able – add anti foam if necessary). 100 µm line definition possible Professional Spray Etching Technology Alkaline Resist Stripping Etching speed with standard Fe-III-Cl: 35 µm Cu in 90s Max. board size 210 x 300 mm (Splash XL 300 x 400mm) Magnetic driven spray pump Built-in 1000 W heater Thermostat controlled Overheat protection Security lid switch Digital timer with count-down, auto-reset and beeper Special shadow-free PCB holder (titanium) Drop-off position for holder (see picture) Built-in pre rinse compartment with integral drop-off zone Also suitable for spray developing Technical Data: Power supply: 230 V~, 50 Hz approx. 1150 VA Dimensions (L x W x H): 60 x 66 x 120 cm (Splash XL 80 x 120 x 65 cm) Tank capacity: 25 l (Splash XL 40l) Weight: 30 kg (Splash XL 40kg)
